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SOLDERING:

Cleanliness

 

Firstly, and without exception, all parts - including the iron tip itself - must be clean and free from contamination. Solder just will not "take" to dirty parts! Old components or copper board can be notoriously difficult to solder, because of the layer of oxidation which builds up on the surface of the leads. This repels the molten solder and this will soon be evident because the solder will "bead" into globules, going everywhere except where you need it. Dirt is the enemy of a good quality soldered joint!

 

Therefore it is absolutely essential that you ensure that parts are free from grease, oxidation and other contamination. In the case of old resistors or capacitors, for example, where the leads have started to oxidise, use a small hand-held file or perhaps scrape a knife blade or rub a fine emery cloth over them to reveal fresh metal underneath. Stripboard and copper printed circuit board will generally oxidise after a few months, especially if it has been fingerprinted, and the copper strips can be cleaned using an abrasive rubber block, like an aggressive eraser, to reveal fresh shiny copper underneath.

 

Also available is a glass fibre filament brush, which is used like a propelling pencil to remove any surface contamination. These tend to produce tiny particles which are highly irritating to skin, so avoid accidental contact with any debris. Afterwards, a wipe with a rag soaked in cleaning solvent will remove most grease marks and fingerprints. After preparing the surfaces, avoid touching the parts afterwards if at all possible.

 

Another side effect of having dirty surfaces is the tendency for people to want to apply more heat in an attempt to "force the solder to take". This will often do more harm than good because it may not be possible to burn off any contaminants anyway, and the component may be overheated. In the case of semiconductors, temperature is quite critical and they may be harmed by applying such excessive heat.

 

Before using the iron to make a joint, it should be "tinned" (coated with solder) by applying a few millimetres of solder, then wiped on a damp sponge preparing it for use: you should always do this immediately with a new bit, anyway. Personally, I always re-apply a very small amount of solder again, mainly to improve the thermal contact between the iron and the joint, so that the solder will flow more quickly and easily. It's sometimes better to tin larger parts as well before making the joint itself, but it isn't generally necessary with printed circuit board work. A worthwhile product is Weller's Tip Tinner & Cleaner, a small 15 gram tinlet of paste onto which you dab a hot iron - the product cleans and tins the iron ready for use. An equivalent is Adcola Tip-Save.

 

Normal electronics grade solder is usually 60% lead - 40% tin or 40/60, and it already contains cores of "flux" which helps the molten solder to flow more easily over the joint. Flux removes oxides which arise during heating, and is seen as a brown fluid bubbling away on the joint. Acid fluxes (e.g. as used by plumbers) should never be necessary in normal electronics applications. Other solders are available for specialist work, including aluminium and silver-solder. Different solder diameters are produced, too; 20-22 SWG (19-21 AWG) is 0.91-0.71mm diameter and is fine for most work. Choose 18 SWG (16 AWG) for larger joints requiring more solder.